Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature

TitleLow-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature
Publication TypeJournal Article
Year of Publication2022
AuthorsWielandt, Stijn, Sebastian Uhlemann, Sylvain Fiolleau, and Baptiste Dafflon
JournalSensors
Volume22
Issue7
Pagination2814
Date PublishedJan-04-2022
DOI10.3390/s22072814